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INPANEL PIR BOARDS
- INPANEL® is rigid PIR thermal insulation boards.
- It has excellent thermal resistance, making it suitable for thermal applications.
- It is environmental friendly with CFC & HCFC Free, Zero ODP & Low GWP.
| Brief Description | Rigid PIR foam (Polymer) based on special grade Methylene Di-Phenyl Di-Isocyanate (MDI) & Polyol chemical systems. |
|---|---|
| Material Type | Highly thermal resistive material with core material sandwiched between flexible facings like - FSK, Aluminium Foil or Kraft Paper |
| Color | Off-white |
| Applications | Building Wall, Under-deck insulation |
STANDARD DIMENSIONS:
| Thickness (mm) | Width (mm) | Length (mm) |
|---|---|---|
| 20, 30, 40, 50 | 1200 | 1200 to 4000 |
THERMAL CONDUCTIVITY (K-VLAUE):
| Mean Temperature (°C) | 10 |
|---|---|
| Thermal Conductivity (W/mK) | 0.021 |
THERMAL RESISTANCE ( R VALUE) AT 10C MEAN TEMP:
| Thickness (mm) | R- Value (m².K/W) | R- Value (hr.ft²°F/Btu) |
|---|---|---|
| 20 | 0.95 | 5.40 |
| 30 | 1.42 | 8.11 |
| 40 | 1.90 | 10.81 |
| 50 | 2.38 | 13.51 |
TECHNICAL DATA:
| Property | Value | Testing Standard |
|---|---|---|
| Overall foam density | 45±3 Kg/m³ | IS:11239(Part2) |
| Initial thermal conductivity | 0.021 W/m.K (at 10 deg. Mean Temp.) (Max.) | ASTM C518 |
| Tensile strength | 395.9 Kpa (Max.) | BS 4370 (part 2) |
| Bending strength | 947 Kpa (Max.) | IS:11239(Part 10) |
| Compressive strength | 116 Kpa (Max.) | IS:11239(Part 11) |
| Water absorption (By volume) | 0.61% (Max.) | ASTM D2842 |
| Water vapour transmission (Permeability) | 0.017 ng/s.m.Pa (Max.) | ASTM E96 |
| Closed cell content | 90.4 % (Max.) | IS:11239(Part 5) |
| Dimensional stability | 0.17% (at 1000°C) | IS:11239(Part 3) |
| Sound Transmission Class (STC) | 8±2 db | ISO: 10140/ASTM E90 |
| Fire performance Characteristics | a) Fire performance according to building regulation: Class 0 b) Surface flame spread: class 1 |
BS 476 part 6 & 7 BS 476 part 7:1997 |
| Horizontal burning characteristics | Complying to IS 12436 |
ENVIRONMENTAL & BIOLOGICAL COMPLIANCE:
| Environmental & green building compliance | CFC & HCFC free, Zero ODP, Low GWP, asbestos & odor free, corrosion and chemical resistant |
| Biological compliance | Fungal & bacterial resistant, anti-rodent |
FEATURES:
- Comply to green building requirements
- Lower smoke index
- CFC and HCFC free
- Lower U - value
- Higher R- value
- Zero ODP
- Low GWP
- Cleanable & hygienic
- Low water vapour transmission
- Anti rodent
- No fungus growth
- Uniform density
- Closed cell structure
- Excellent thermal and dimensional stability
- No corrosion
- Light weight
- Low handling cost
- Low structural support requirement
- Good aesthetics
- High compressive strength
- Low installation time required
- High energy cost savings due to lower thermal conductivity of PIR insulation
INPANEL® APPLICATION AREA:
1) UNDERDECK INSULATION APPLICATIONS:
- RCC ceiling of any buildings could be the prime aspect of heat gain inside the building. In such cases heat gain takes place from the RCC ceiling to inside the building providing discomfort to the occupants. It will certainly increase the energy consumption of the building.
- INPANEL having low thermal conductivity shall be fixed under the RCC ceiling of building to reduce heat gain through the RCC ceiling & helps in maintaining the temperature inside the building.
- INPANEL being CFC & HCFC free also complies with green building norms.
2) BUILDING WALL :
- Various walls of the buildings are directly exposed to the atmosphere causing them to gain heat In case of hot climatic conditions. If the walls of these buildings are not insulated thermally then the buildings will gain heat from the walls which will increase the energy consumption of the building while providing thermal comfort to the occupants.
- Also if the insulating material does not have the biological compliance, then it will allow the fungal & bacterial growth in case of moisture absorption through walls.
- INPANEL having high thermal resistance & posses the biological compliance when fixed on the wall of the building, will control the heat gain through the walls, helps in maintaining the inside temperature of the building thereby reducing the energy consumption of the building & also controls fungal & bacterial growth.
